Centerm Invited to Intel Thin Client Summit India,2019

April 28, 2019
Centerm, the global leader in thin clients, financial terminals and payment terminals, has been invited to attend Intel Thin Client Summit held on April 26, 2019, in Bangalore, India.

This Summit gathered Intel channel partners, Intel executives and Indian IT elites, sharing valuable ideas and suggestions on the complexity and security of Thin Client and how to protect enterprise IT property through thin client.
 
It offered a great platform for Centerm to have a communication with these experts and explore future development trend of thin clients.


Mr. Alec Gefrides, Director of Retail Platform from Intel, explained the keynote of this dialogue, analyzed the workload consolidation for thin client applications and its advantages.
 

At this summit, Centerm product and solution have attracted many partners. Centerm has been focusing on development and technology of thin client since 2002, and now has been Global Top 3 thin client vendor, providing high security solution for enterprises around the world.